SCHÖNOX - FP FLEXIBLE ONE-PART FILLING AND PRIMING COMPOUND 33 LB BAG

Supplier SKU: H-FP33P
East Bay Supply SKU: SHXFP

FP Flexible one-part filling and priming compound prevents self leveling underlayments from passing through joints and breakouts in wooden floors or similar substrates to be renovated. May also be used to embed Schonox RENOTEX for substrate solidification.

Features:

For interior and exterior use
EMICODE EC 1 Plus: very low emission
Solvent-free
Moisture-resistant
Fined-grained for a very smooth application
Quick drying time
Good bonding on nearly all substrates
Easy to mix, no direct thickening after mixing
Variable adjustable consistency
No bonding to the trowel, easy clean up
Synthetic resin-modified
Suitable for application on subfloor heating systems

FP is suitable as a filling primer:

in combination with RENOTEX to isolate cracks up to 1/8"
to improve adhesion on various old substrates
as a primer to improve adhesion on smooth and sound substrates
as a primer to protect against moisture from leveling compounds (apply closed film)
embedding of electrical floor heating systems or reinforcement fabrics
bonding of suitable decoupling boards

Coverage: Approx. 200-400 sf depending on porosity of substrate and layer thickness applied

Pot Life: Approx. 30 minutes

Application Temperature: Not below 41°F floor temperature

Ready for Foot Traffic: After approx. 30 minutes

Ready for Leveling Compounds: Approx. 60-180 minutes depending on layer thickness

Shelf Life: One year in unopened package. Opened packages should be closed immediately and used up as soon as possible.

Technical Data Sheet