SCHÖNOX - AP RAPID PLUS HYBRID ACTIVE SELF-LEVELING COMPOUND 55 LB

Supplier SKU: H-APRP55LH
East Bay Supply SKU: SHXAPRAPIDPLUS

AP RAPID PLUS synthetic self-leveling compound based on Hybrid Active Dry Technology is designed for deep pour, fast track installations on most substrates in interior areas such as apartment complexes, assisted living facilities and educational facilities. Schönox AP Rapid Plus can be installed above 1/8" up to 3" in small, well-designed areas without limitations.

Features:

EMICODE EC 1PLUS: very low emission
Based on Hybrid Active Dry Technology
Designed for fast track installations in residential areas
For interior use only
Low dust
Suitable on underfloor heating systems
Very low shrinkage
Pumpable
Suitable for castor wheel loadings
Layer thicknesses above 1/16" up to 1/2"

Applications:

AP RAPID PLUS is suitable for filling, smoothing and leveling of substrates:

Under flexible coverings
Under wood floor, layer thickness at least 1/8"

AP RAPID PLUS is suitable on:

Concrete and cement substrates
Gypsum substrates
Old floorings such as ceramic tiles, terrazzo and sheet vinyl/rubber/resilient floor coverings
Old, water-resistant adhesive residues
OSB board, plywood

Coverage: Approx. 14 sq. ft. per unit at a thickness of 1/2"

Pot Life: Approx. 30 minutes at 68 degrees F

Ready for Foot Traffic: Approx. 2-3 hours

Ready for Covering:

after 16 hours at 1/2" thickness
after 48 hours at 2" thickness

Shelf Life: One year in unopened package

Technical Data Sheet