Supplier SKU: H-APRP55LH
East Bay Supply SKU: SHXAPRAPIDPLUS
AP RAPID PLUS synthetic self-leveling compound based on Hybrid Active Dry Technology is designed for deep pour, fast track installations on most substrates in interior areas such as apartment complexes, assisted living facilities and educational facilities. Schönox AP Rapid Plus can be installed above 1/8" up to 3" in small, well-designed areas without limitations.
Features:
- EMICODE EC 1PLUS: very low emission
- Based on Hybrid Active Dry Technology
- Designed for fast track installations in residential areas
- For interior use only
- Low dust
- Suitable on underfloor heating systems
- Very low shrinkage
- Pumpable
- Suitable for castor wheel loadings
- Layer thicknesses above 1/16" up to 1/2"
Applications:
AP RAPID PLUS is suitable for filling, smoothing and leveling of substrates:
- Under flexible coverings
- Under wood floor, layer thickness at least 1/8"
AP RAPID PLUS is suitable on:
- Concrete and cement substrates
- Gypsum substrates
- Old floorings such as ceramic tiles, terrazzo and sheet vinyl/rubber/resilient floor coverings
- Old, water-resistant adhesive residues
- OSB board, plywood
Coverage: Approx. 14 sq.ft. per unit at a thickness of 1/2"
Pot Life: Approx. 30 minutes at 68 degrees F
Ready for Foot Traffic: Approx. 2-3 hours
Ready for Covering:
- after 16 hours at 1/2" thickness
- after 48 hours at 2" thickness
Shelf Life: One year in unopened package
Technical Data Sheet
